Reference,Value,Footprint,Manufacturer Part Number,Qty,Notes
L_OUT_A/B/C/D,15uH Class-D inductor,Inductor_SMD:L_Coilcraft_SER2011,Coilcraft SER2011-153ME,4,One per half-bridge; VERIFY Isat for load current. Alt: Wurth 7443631500
C_OUT_A/B/C/D,680nF 250V film,Capacitor_THT:C_Rect_L13.0mm_W5.0mm_P10.00mm,WIMA MKP1O132205F00KSSD or Panasonic ECW-F2684JAQ,4,LC filter cap — film rated well above PVDD ripple
C_PVDD_100n,100nF X7R 50V/100V,Capacitor_SMD:C_0805_2012Metric,Murata GRM21BR72A104KA01L,16,Multiple per PVDD pin group — count from EVM
C_PVDD_1u,1uF X7R 50V/100V,Capacitor_SMD:C_1206_3216Metric,Murata GRM31CR72A105KA01L,8,Mid-frequency PVDD bypass
C_PVDD_BULK,1000uF 50V low-ESR,Capacitor_THT:CP_Radial_D16.0mm_P7.50mm,Panasonic EEU-FR1H102 or Nichicon UHE1H102,2+,Bulk reservoir; size for bass current / channel count
R_IN,100R 1% 0.125W,Resistor_SMD:R_0805_2012Metric,Vishay CRCW0805100RFKEA,4,Analog input series R (tune per EVM)
C_IN,2.2nF C0G 50V,Capacitor_SMD:C_0805_2012Metric,Kemet C0805C222J5GACTU,4,Input HF roll-off — VERIFY vs EVM values
C_BOOT,Bootstrap cap (per datasheet),Capacitor_SMD:C_0805_2012Metric,See TPA3255EVM BOM,4,Do not guess — copy EVM value/dielectric
U1,TPA3255DDV,Package_SO:HTSSOP-44-1EP_4.4x11.3mm_P0.65mm_EP,TPA3255DDVR,1,Import footprint+symbol from TI; thermal pad required
HS_PAD,Thermal via array + heatsink,MountingHardware,Per datasheet land pattern,1,4-layer with via farm under PowerPAD
J_SPK,Speaker connector,Connector_PinSocket_2.54mm:PinSocket_1x02_P2.54mm_Vertical,On-Shore ED120/2DS or binding posts,2,Per BTL channel pair